Methods and apparatus for microelectronic component manufacture

A method of processing packaged microelectronic components, comprising:

• heating a plurality of packaged microelectronic components to a stress temperature of at least about 215° C.;
• thereafter, applying a solder to contacts carried by each of the packaged microelectronic components;
• testing performance of the solder-bearing packaged microelectronic components;
• and
• rejecting as defective any packaged microelectronic component that fails to meet minimum performance criteria in the performance testing.

A system for processing packaged microelectronic components, comprising:

• a first loading station adapted to receive a first magazine containing a plurality of packaged microelectronic components;
• a heating apparatus adapted to heat the packaged microelectronic components to a reflow temperature of a selected solder, the first loading station being adapted to transfer the packaged microelectronic components out of the first magazine and to the heating apparatus;
• a solder plating apparatus adapted to receive the packaged microelectronic components from the heating system, the solder plating apparatus being adapted to deposit the selected solder on contacts of the packaged microelectronic components;
• and
• a second loading station adapted to transfer the packaged microelectronic components from the solder plating apparatus to a second magazine.

A system for processing microelectronic components, comprising:

• a cure station adapted to receive a first magazine carrying plurality of microelectronic components, each of which includes a curable encapsulant, the cure station being adapted to cure the curable encapsulant by heating the microelectronic components to an encapsulant cure temperature in the first magazine
• a pre-solder heating apparatus adapted to heat the packaged microelectronic components to a reflow temperature of a selected solder, the reflow temperature being greater than the encapsulant cure temperature;
• a first transport adapted to transport the magazine of cured microelectronic components from the cure station to the pre-solder heating apparatus and transfer the cured microelectronic components out of the first magazine and to the pre-solder heating apparatus;
• a solder plating apparatus adapted to receive the microelectronic components from the pre-solder heating apparatus, the solder plating apparatus being adapted to deposit the selected solder on contacts of the microelectronic components;
• a testing system adapted to test performance of the solder-bearing microelectronic components;
• and
• a second transport adapted to transfer the microelectronic components from the solder plating apparatus to a second magazine and transport the second magazine for further processing.