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US 2003/0212966 A1Published application
Optimization of die placement on wafers
AssigneeWaferYield, Inc.
InventorEitan Cadouri
Life of this patent
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Abstract
A method of optimizing production of semiconductor devices on a wafer comprises steps of characterizing at least one effect of at least one manufacturing component on at least one optimization criterion; inputting user optimization data; and, based on the at least one effect and the user optimization data, performing optimization to determine a layout of semiconductor devices on the wafer that optimizes performance according to the user optimization data.
Claims18
A method of optimizing production of semiconductor devices on a wafer, comprising the steps of:
- characterizing at least one effect of at least one manufacturing component on at least one optimization criterion;
- inputting user optimization data;
- and
- based on the at least one effect and the user optimization data, performing optimization to determine a layout of semiconductor devices on the wafer that optimizes performance according to the user optimization data.
1 more element
Dependencies are inferred from the claim text.