US 2003/0211675 A1 · Stacked local interconnect structure and method of fabricating same

Abstract

A method of forming stacked local interconnects that do not extend into higher levels within a multilevel IC device for economizing space available within the IC device and increasing design flexibility. In one embodiment, the method of the present invention provides a stacked local interconnect which electrically connects a first group of interconnected electrical features with one or more additional isolated groups of interconnected electrical features or one or more isolated individual electrical features. In a second embodiment, the method of the present invention provides a stacked local interconnect which electrically connects an individual electrical feature to one or more additional isolated electrical features.

Claims3

Dependent claims

A method for minimizing etching damage of a semiconductor substrate having a plurality of features, comprising:

forming a passivation layer over portions of said semiconductor substrate;
forming an interlayer dielectric over said passivation layer;
selecting one or more device features to be protected from said inadvertent etching during said manufacturing operations;
and
providing a metallization layer over said one or more device features for protection thereof.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/407,642Filed 4 Apr 2003

Priority

9 Nov 2000

Published

13 Nov 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification4 codes

H10W 20/0698
Of conductive parts of the interconnections: local interconnections
H10W 20/069
Of conductive parts of the interconnections: by forming self-aligned vias or self-aligned contact plugs
H10W 20/40
Interconnections in chips, wafers or substrates: interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or…
H10W
Generic packages, interconnections, connectors or other constructional details of devices covered by

Family

Application09/710,399Division · filed 9 Nov 2000

Application09/892,956Continuation · filed 27 Jun 2001

Application09/892,956Division · filed 27 Jun 2001

Application10/050,630Continuation · filed 15 Jan 2002

Application10/407,642Continuation · filed 4 Apr 2003

US 2002/0055214 A1Published application

US 2002/0068397 A1Published application

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