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AssigneeSamsung Electronics Co., Ltd.
InventorsYi-Sung Hwang, Sang-Woo Kim
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A semiconductor chip package with direction-flexible mountability comprising a switching circuit for switching a pin function according to the mounting direction of a package, a pair of pin-definition pins for defining the pin function and a pair of power supply leads, and a pair of ground leads. One of the power supply lead pair and the ground lead pair is rotation-symmetrical to the other, respectively. The semiconductor chip package with direction-flexible mountability in accordance with the present invention eliminates a process for indicating the mounting direction because the package can be mounted onto a substrate regardless the direction. Accordingly, the ID pin indication and a series of processes for testing the ID pin are eliminated and the malfunction due to the incorrect direction is prevented.
A semiconductor chip package with direction-flexible mountability comprising:
A semiconductor chip package comprising a semiconductor chip having an integrated circuit and a plurality of leads which are arranged along the confronting two sides thereof, wherein the semiconductor chip includes a switching circuit for switching a pin function according to the mounting direction of the package, a pair of pin definition leads for defining the pin function and a pair of power supply leads and a pair of ground leads, one of which is rotation-symmetrical to the other, respectively.
A semiconductor chip package comprising:
Dependencies are inferred from the claim text.