Flash memory device and fabricating method therefor
AssigneeNone recorded
InventorsJong Il Kim, Choong Ho Hwang
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AssigneeNone recorded
InventorsJong Il Kim, Choong Ho Hwang
Estimating the term…
A flash memory device and fabricating method thereof. The fabricating method comprises the steps of: forming a floating gate oxide film on a silicon substrate, forming a floating gate on the floating gate oxide film, forming a control gate oxide film on the floating gate, forming a control gate including slant side surfaces on the control gate oxide film; and the flash memory device comprises: a floating gate oxide film formed on a silicon substrate, a floating gate formed on the floating gate oxide film, a control gate oxide film formed on the floating gate, and a control gate formed on the control gate oxide film and including slant side surfaces.
A flash memory device comprising:
A method for fabricating a flash memory device, the method comprising the steps of:
Dependencies are inferred from the claim text.
No related US applications are recorded in the indexed filing history.
Backward citations are indexed for grants only.
Erasable-and-programmable rom [eprom] devices not provided for in groups h10b41/00 - h10b63/00
Floating-gate IGFETs: characterised by the shapes, relative sizes or dispositions of the floating gate electrode
Electronic memory devices
Inorganic electric semiconductor devices
Term end not estimated
1. Field of the Invention
The present invention relates to a method for fabricating a flash memory device, more particularly to a flash memory device and fabricating method thereof which is capable of increasing activating characteristics and reliability of the device by improving patterning of a control gate.
2. Description of the Prior Art
The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:
FIG. 1A is a schematic sectional view of a general stacked gate cell flash memory transistor showing FN tunneling phenomenon in the case of programming, and FIG. 1B is a schematic sectional view of a general stacked gate cell flash memory transistor in the case of erasing;
FIG. 2 is a schematic view of the conventional stacked gate cell flash memory device in section showing conventional patterning of the control gate;
Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings.
FIG. 3 is a sectional view illustrating a flash memory device and fabricating method thereof in accordance with the present invention.
As shown in FIG. 3, in the flash memory device according to the present invention, a floating gate oxide film 43 is formed on a silicon substrate 41, and a floating gate 45 is formed on the oxide film 43.