Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element

A semiconductor apparatus comprising:

• a plurality of substrate units each including a semiconductor element and a pair of insulation substrates having thermal conductivity and holding the semiconductor element therebetween;
• and
• a radiation member contacting the plurality of substrate units for radiating heat produced from the plurality of substrate units, the radiation member having a single refrigerant passage therein in which refrigerant flows for absorbing the heat.

A semiconductor apparatus comprising:

• a substrate unit including a semiconductor element, and a pair of insulation substrates having thermal conductivity and holding the semiconductor element therebetween;
• and
• a radiation member having a first wall, on which the substrate unit is disposed, for radiating heat produced from the substrate unit, and a second flat wall on an opposite side of the first wall.

A semiconductor apparatus comprising:

• a substrate unit including a semiconductor element, and a pair of insulation substrates having thermal conductivity and holding the semiconductor element therebetween;
• and
• a radiation member disposed in contact with the substrate unit through a contact material for radiating heat produced from the semiconductor unit, the contact material being composed of a resin material having thermal resistance and flexibility, and a thermal-conductive compounding member contained in the resin material.