Vertical/horizontal MIMCap method

A method of fabricating a vertical/horizontal metal-insulator-metal capacitor (MIMCap), comprising:

• providing a wafer having a workpiece;
• depositing a first insulating layer over the workpiece;
• forming a plurality of trenches within the first insulating layer;
• filling the trenches with a first conductive material to form first conductive lines within the first insulating layer;
• depositing a cap layer over the first conductive lines and first insulating layer;
• depositing a second insulating layer over the cap layer;
• depositing a resist over the second insulating layer;
• patterning the resist with a predetermined pattern defining a MIMCap;
• removing portions of the resist to expose portions of the second insulating layer;
• removing the exposed second insulating layer, the cap layer, and portions of the first insulating layer, leaving portions of the first conductive lines exposed;
• removing the remaining resist;
• depositing a capacitor dielectric over the first conductive lines;
• depositing a second conductive material over the capacitor dielectric to form second conductive lines;
• coupling together portions of the first conductive lines;
• and
• coupling together portions of the second conductive lines, wherein portions of the first and second conductive lines comprise the plates of a MIMCap, the MIMCap plates having horizontal and vertical portions.