Negative resist process with simultaneous development and aromatization of resist structures

A process for producing an amplified negative resist structure, which comprises:

• providing a chemically amplified resist including:
• a polymer including acid-labile groups, which by action of an acid, are eliminated and liberate anchor groups, bringing about a change in a polarity of the polymer,
• a photoacid generator, and
• a solvent;
• applying the chemically amplified resist to a substrate;
• removing the solvent to provide a photosensitive resist film;
• obtaining an exposed resist film by sectionally exposing the photosensitive resist film to liberate an acid from the photoacid generator in exposed sections of the photosensitive resist film;
• contrasting the exposed resist film such that the acid-labile groups of the polymer are eliminated by the acid, which has been liberated, and the anchor groups liberated in the exposed sections of the resist film;
• after the contrasting, developing the exposed resist film, with a developer including:
• a solvent in which the polymer, when in a state including the acid-labile groups, is soluble and in which the polymer, when in a state after the anchor groups have been liberated, is substantially insoluble or swellable, and
• an amplifying agent including at least one aromatic group and at least one reactive group that is able to coordinate to the anchor groups of the polymer;
• and
• removing excess developer.