Silicate-containing alkaline compositions for cleaning microelectronic substrates
AssigneeMallinckrodt Inc.
InventorGeorge Schwartzkopf
Life of this patent
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Abstract
A method and composition for removing sodium-containing materials such as photoresist from microcircuit substrate material utilizes 1,2-Diaminocyclohexanetetracarboxylic Acid in an organic solvent.
Claims20
A method of stripping sodium-containing material from a microcircuit substrate, comprising contacting said substrate with a stripping composition comprising 1,2-Diaminocyclohexanetetracarboxylic Acid (CYDTA) in an organic solvent.
An alkaline-containing photoresist stripper composition comprising on a weight basis:
- from about 50% to about 98% of a stripping solvent having a Hansen solubility parameter of from about 8 to about 15,
- from about 1% to about 50% by weight of a nucleophilic amine,
- from about 0.05% to about 25% by weight of a non-nitrogen containing weak acid having a pK value in aqueous solution of 2.0 or greater, and equivalent weight of less than 140 and present in the stripping composition in an amount to partially neutralize the nucleophilic amine such that the stripping composition has an aqueous pH, when diluted with about 10 parts of water, of about 9.6 to about 10.9, and
- from about 0.01% to 5% of 1,2-Diaminocyclohexanetetracarboxylic Acid.
An alkaline-containing photoresist stripping composition comprising on a weight basis from about 50% to about 98% of N-methyl-2-pyrrolidinone, from about 1 to about 20% of tetrahydrothiophene-1,1-dioxide, from about 1 to about 20% of water, from about 1 to about 50% of 2-aminoethanol, from about 0.05% to about 25% of 1,2-dihydroxybenzene present in an amount whereby the amine is neutralized such that the stripping composition has an aqueous pH, when diluted with about 10 parts of water, of about 9.6 to about 10.9, and about 0.01% to 5% of 1,2-Diaminocyclohexanetetracarboxylic Acid.
A photoresist stripping composition comprising a stripping solvent and 1,2-Diaminocyclohexanetetracarboxylic Acid.
Dependencies are inferred from the claim text.