Data collection and correction methods and apparatus
AssigneeOnWafer Technologies, Inc.
InventorsKameshwar Polla, Costas J. Spanos
Life of this patent
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Abstract
Described are methods and apparatus for collecting measured parameter data for applications such as deriving response models and information required for developing and maintaining processes and process tools. The methods and apparatus are capable of deriving correction factors for the measured data and applying the corrections factors to the measured data so as to provide corrected parameter data having increased accuracy.
Claims29
A method of deriving operating characteristics for a process tool used for processing workpieces the method being performed with a sensor apparatus having a plurality of detectors, the method comprising the steps of:
- a) loading a sensor apparatus including electronic devices into the process tool;
- b) measuring the operating characteristics with the sensor apparatus;
- c) converting the measured operating characteristics into digital data;
- d) deriving correction factors for the measurements;
- and
- e) applying the correction factors to the measured data so as to generate corrected data.
An apparatus for generating corrected data for process tools used for processing workpieces, the apparatus comprising:
- a base;
- at least one base sensor supported by the base, the sensor being capable of measuring data representing a condition of the base;
- an electronics module comprising an information processor, the electronics module being supported by the base;
- at least one electronics module sensor coupled to the electronics module for measuring data representing a condition of the electronics module;
- and
- the information processor being connected with the base sensor and the electronics module sensor so as to receive data from the sensors.
A method of deriving parameter data for a uniform workpiece using measurements from a sensor apparatus having portions with dissimilar properties, the method comprising the steps of:
- a) coupling at least one detector with a first portion of the sensor apparatus, the first portion having substantially uniform properties;
- b) coupling at least one detector with a second portion of the sensor apparatus, the second portion having substantially uniform properties;
- c) measuring the parameter using the at least one detector of step a;
- d) measuring the parameter using the at least one detector of step b;
- e) providing at least one property of the second portion of the sensor apparatus;
- f) providing at least one equation for substantially representing the behavior of the second portion as a function of the parameter;
- g) using the equation and parameter measurements for the second portion to derive correction factors;
- and
- h) applying the correction factors to the measured parameters so as to obtain corrected data for the parameters.
A method of deriving parameter data for a substantially uniform workpiece using measurements from a sensor apparatus, the workpiece and at least a portion of the sensor apparatus having dissimilar properties, the method comprising the steps of:
- a) coupling at least one detector with a first portion of the sensor apparatus, the first portion having substantially uniform properties;
- b) coupling at least one detector with a second portion of the sensor apparatus, the second portion having substantially uniform properties, wherein the properties of the workpiece and the properties of the second portion are dissimilar;
- c) measuring the parameter using the at least one detector of step a;
- d) measuring the parameter using the at least one detector of step b;
- e) providing at least one property of the second portion of the sensor apparatus;
- f) providing at least one equation for substantially representing the behavior of the second portion as a function of the parameter;
- g) using the equation of step f and parameter measurements for the second portion to derive correction factors;
- and
- h) applying the correction factors to the measured parameters so as to obtain corrected data for the parameters.
An apparatus for generating corrected temperature data for processing substrates in a process tool, the apparatus comprising:
- a base;
- at least one base temperature sensor coupled to the base, the sensor being capable of measuring the temperature of the base;
- an electronics module supported by the base, the electronics module having an information processor;
- at least one electronics module sensor coupled to the electronics module for measuring the temperature of the information processor;
- the information processor being connected with the base temperature sensor and the electronics module temperature sensor so as to receive temperature data from the sensors, the information processor being capable of calculating correction factors using at least one thermal conductivity characteristic of the information processor and data from the information processor temperature sensor;
- the information processor being capable of applying the correction factors to the measured temperatures from the base temperature sensor so as to obtain corrected temperature data.
A computer program product for correcting temperatures measured with a sensor apparatus, the sensor apparatus comprising a semiconductor wafer, a plurality of temperatures sensors coupled to the wafer, an electronics module supported by the wafer, and a temperature sensor coupled to the electronics module, the computer program product comprising executable steps for:
- a) acquiring measured wafer temperature data as a function of time and spatial position;
- b) generating additional data by interpolation using the measured wafer temperature data so as to obtain temperatures for least one of a fine time scale and a fine spatial grid scale;
- c) acquiring measured electronics module temperature data;
- d) calculating temperature correction factors using heat transfer coefficients for the electronics module and the measured electronics module temperature data;
- e) reducing the correction factors of step d to at least one of the time scale of the measured temperatures and the spatial grid scale of the measured temperatures so as to correspond to step b;
- and
- f) applying the correction factors to the measured data so as to provide corrected temperatures for the measured temperatures.
A system for collecting and correcting parameter measurements, the system comprising a sensor apparatus for collecting measurement data, an external information processor, and a communication mechanism for transmitting information between the sensor apparatus and the external information processor, the external information processor being capable of generating correction factors for correcting the parameter measurements and applying the correction factors to the measured data so as to obtain corrected measurement data.
Dependencies are inferred from the claim text.