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AssigneeNorthrop Grumman Corporation
InventorsMichael D. Lammert, Victor J. Watson, John M. DiMond, Michael E. Barsky
Estimating the term…
Semiconductor wafer (11) are uniformly and thoroughly cleaned of particulate and organic contaminants by sweeping the wafer with a hydraulic broom that sprays cleaning solution onto the wafer. The broom contains an aspirating nozzle (3) for connection to a source of pressurized gas, such as nitrogen, and to a source of cleaning fluid, such as acetone, wherein cleaning fluid aspirated by the gas stream is expressed through the nozzle outlet to impact the surface of the wafer, dislodging particulate matter and dissolving organic contaminants. A programmed controller (9) controls movement of the hydraulic broom relative to the wafer to ensure that the entire surface is cleaned and permits a variety of sweeping patterns.
An automated cleaning apparatus for cleaning semiconductor wafers, comprising:
An automated cleaning apparatus for cleaning semiconductor wafers, comprising:
The method of cleaning the surface of a semiconductor wafer comprising the steps of:
The method of cleaning a wafer of semiconductor material comprising the steps of:
Dependencies are inferred from the claim text.