High-frequency line
AssigneeSTMicroelectronics S.r.l.
InventorsTorres Joaquim, Arnal Vincent, Farcy Alexis
Life of this patent
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Abstract
A method for forming at least one conductive line intended to receive high-frequency or high-value currents, formed above a given portion of a solid substrate outside of which are formed other elements, including the steps of digging at least one trench in the solid substrate; forming an insulating area in the trench; and forming said conductive line above the insulating area.
Claims7
A method for forming at least one conductive line intended to receive high-frequency or high-value currents, formed above a given portion of a solid substrate (20) outside of which are formed other elements, including the steps of:
- a) digging a plurality of trenches into the solid substrate, so that pillars remain between the trenches;
- b) etching said pillars so that their upper surface level is under the upper surface level of the substrate;
- c) forming an insulating area in the trench;
- and
- d) forming said conductive line above the insulating area.
A method for forming at least one conductive line intended to receive high-frequency or high-value currents, formed above a given portion of a solid substrate (20) outside of which are formed other elements, including the steps of:
- digging a trench in the solid substrate;
- depositing an insulating material in said trench, so that its upper surface is substantially coplanar with the upper surface of the peripheral solid substrate;
- forming in and on the substrate, except above the trench filled with the material, at least a portion of the other elements;
- digging chimneys to partially expose the upper surface of the material;
- causing the removal of the material, whereby a cavity is formed in the solid substrate;
- and
- closing the chimneys by depositing an insulating material to maintain the cavity intact.
Dependencies are inferred from the claim text.