Split-mold and method for manufacturing semiconductor device by using the same
AssigneeFujitsu Limited of Kawasaki
InventorYasuhiro Shinma
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Abstract
A split-mold, which is used for manufacturing semiconductor devices by resin-encapsulating a substrate on which a plurality of semiconductor chips are formed, includes a first mold and a second mold. The second mold has a pressing surface that is provided with a mold release sheet. The second mold has a mold-release-sheet mechanism holding a mold release sheet outside the pressing surface of the second mold and applying tension to the mold release sheet.
Claims6
A split-mold for manufacturing semiconductor devices by encapsulating a substrate, on which a plurality of semiconductor chips are formed, with resin, said split-mold comprising:
- a first mold;
- and
- a second mold;
- wherein said second mold relatively approaches to or separates from a pressing surface of said first mold, and is provided with an inner portion and at least one outer movable portion that surrounds said inner portion and is able to be separately moved with respect to said inner portion.
A split-mold for manufacturing semiconductor devices by encapsulating a substrate, on which a plurality of semiconductor chips are formed, with resin, said split-mold comprising:
- a first mold;
- and
- a second mold;
- wherein:
- said second mold has a pressing surface that is provided with a mold release sheet;
- and
- said second mold has a mold-release-sheet mechanism holding a mold release sheet outside said pressing surface of said second mold and applying tension to said mold release sheet.
Dependencies are inferred from the claim text.