Wet stripping apparatus and method of using

A method for removing unwanted film layers from a wafer surface by wet stripping comprising the steps of:

• providing a tank body and filling the tank body with a volume of a stripper solution;
• providing a wafer holder holding at least one wafer therein in a vertical position with a planar surface of the wafer parallel to a vertical tank wall of said tank body;
• mounting said wafer holder in said tank body immersed in said stripper solution;
• and
• moving said wafer holder reciprocally in an up-and-down motion with said at least one wafer immersed in said stripper solution at a frequency of not more than 100 cycle/min.

A method for removing unwanted film layers from a wafer surface by wet stripping comprising the steps of:

• providing a tank body and filling the tank body with a volume of a stripper solution;
• providing a wafer holder holding at least one wafer therein in a vertical position with a planar surface of the wafer parallel to a vertical tank wall of said tank body;
• mounting said wafer holder in said tank body and immersing said at least one wafer stationarily in said stripper solution for a time period of at least 3 min;
• and
• moving said wafer holder reciprocally in an up-and-down motion with said at least one wafer immersed in said stripper solution at a frequency of not more than 100 cycle/min.