US 2002/0160625 A1 · Method and system for processing substrate

Abstract

A method and system for processing a substrate includes performing a wet process by supplying a working liquid to a substrate in a wet processing apparatus, transferring the substrate in a non-dry state from the wet processing apparatus to a drying apparatus, and subjecting the substrate to a supercritical drying by a supercritical fluid in the drying apparatus.

Claims14

Dependent claims

A method for processing a substrate comprising:

a wet processing step of processing a substrate by supplying a working liquid to the substrate in a wet processing apparatus;
a transferring step of transferring the processed substrate in a non-dried state from the wet processing apparatus to a drying apparatus;
and
a supercritical drying step of subjecting the processed substrate to a supercritical drying by a supercritical fluid in the drying apparatus.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

10/132,212Filed 26 Apr 2002

Priority

JP 2001-13300427 Apr 2001

Published

31 Oct 2002

Term ends

Not estimatedThe source records don’t support an estimate.

Classification3 codes

H10P 70/15
Cleaning before device manufacture, i.e. Begin-Of-Line process: by wet cleaning only
H10P 72/0406
Apparatus for fluid treatment: for cleaning followed by drying, rinsing, stripping, blasting or the like
H10P
Generic processes or apparatus for the manufacture or treatment of devices covered

Method and system for processing substrate

Life of this patent

Method and system for processing substrate

Life of this patent

Abstract

Claims14