Arrangement for dissipating thermal energy generated by heat source
OwnerTimo Heikkila, Reijo Lehtiniemi +2inventors
InventorsTimo Heikkila, Reijo Lehtiniemi, Carl Kabrell, Jukka Rantala
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OwnerTimo Heikkila, Reijo Lehtiniemi +2inventors
InventorsTimo Heikkila, Reijo Lehtiniemi, Carl Kabrell, Jukka Rantala
Estimating the term…
The invention relates to an arrangement for dissipating thermal energy generated by a heat source (1), which arrangement comprises a heat conductor element (2) for conducting thermal energy generated by the heat source (1) away from the heat source (1), the heat conductor element (2) having at least one micro heat pipe module (3) attached to it for distributing thermal energy generated by the heat source (1) in the heat conductor element (2). The heat source (1) is attached to an element (4) which is made of a heat conducting material and which is in thermal contact with the heat conductor element (2) and which is arranged to conduct thermal energy from the heat source (1) to the heat conductor element (2) by means of the heat conducting ability of said heat conducting material.
An arrangement for dissipating thermal energy generated by a heat source, which arrangement comprises a heat conductor element for conducting thermal energy generated by the heat source away from the heat source, the heat conductor element having at least one micro heat pipe module attached to it for distributing thermal energy generated by the heat source in the heat conductor element,
An arrangement for dissipating thermal energy generated by a heat source, which arrangement comprises a heat conductor element for conducting thermal energy generated by the heat source away from the heat source, the heat conductor element having at least one micro heat pipe module attached to it for distributing thermal energy generated by the heat source in the heat conductor element,
Dependencies are inferred from the claim text.