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US 2002/0116836 A1Published application
Method and apparatus for heating and cooling substrates
AssigneeApplied Materials, Inc.
InventorsRatson Morad, Ho Seon Shin, Robin Cheung, Igor Kogan
Life of this patent
Estimating the term…
Abstract
A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.
Claims43
A fabrication system comprising:
- a process chamber;
- a heating and cooling chamber including:
- a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism;
- a coolable member spaced from the heating mechanism and adapted to cool a substrate positioned proximate the coolable member, the coolable member being coolable by a cooling mechanism;
- and
- a transfer mechanism adapted to transfer a substrate between a position proximate the heating mechanism and a position proximate the coolable member;
- and
- a substrate handler adapted to transfer a substrate between the process chamber and the heating and cooling chamber.
5 more elements
A fabrication system comprising:
- a process chamber adapted to perform a deposition process on a substrate;
- a heating and cooling chamber adapted to perform a copper anneal process on a substrate processed within the process chamber, the heating and cooling chamber including:
- a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism;
- a coolable member spaced from the heating mechanism and adapted to cool a substrate positioned proximate the coolable member, the coolable member being coolable by a cooling mechanism;
- and
- a transfer mechanism adapted to transfer a substrate between a position proximate the heating mechanism and a position proximate the coolable member;
- and
- a substrate handler adapted to transfer a substrate between the process chamber and the heating and cooling chamber.
5 more elements
A method comprising:
- (a) providing a fabrication system having:
- a process chamber;
- a heating and cooling chamber including:
- a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism;
- a coolable member spaced from the heating mechanism and adapted to cool a substrate positioned proximate the coolable member, the coolable member being coolable by a cooling mechanism;
- and
- a transfer mechanism adapted to transfer a substrate between a position proximate the heating mechanism and a position proximate the coolable member;
- and
- a substrate handler adapted to transfer a substrate between the process chamber and the heating and cooling chamber;
- (b) processing a substrate within the process chamber;
- (c) transferring the substrate from the process chamber to the heating and cooling chamber;
- and
- (d) annealing the substrate within the heating and cooling chamber.
10 more elements
A method comprising:
- (a) providing a fabrication system having:
- a process chamber adapted to perform a deposition process on a substrate;
- a heating and cooling chamber including:
- a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism;
- a coolable member spaced from the heating mechanism and adapted to cool a substrate positioned proximate the coolable member, the coolable member being coolable by a cooling mechanism;
- and
- a transfer mechanism adapted to transfer a substrate between a position proximate the heating mechanism and a position proximate the coolable member;
- and
- a substrate handler adapted to transfer a substrate between the process chamber and the heating and cooling chamber;
- (b) performing a deposition process on a substrate within the process chamber;
- (c) transferring the substrate from the process chamber to the heating and cooling chamber;
- and
- (d) performing a copper annealing process on the substrate within heating and cooling chamber.
10 more elements
A method of heating and cooling a substrate comprising:
- (a) providing a fabrication system having:
- a process chamber;
- a heating and cooling chamber including:
- a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism;
- a coolable member spaced from the heating mechanism and adapted to cool a substrate positioned proximate the coolable member, the coolable member being coolable by a cooling mechanism;
- and
- a transfer mechanism adapted to transfer a substrate between a position proximate the heating mechanism and a position proximate the coolable member;
- and
- a substrate handler adapted to transfer a substrate between the process chamber and the heating and cooling chamber;
- (b) processing the substrate within the process chamber;
- (c) transferring the substrate from the process chamber to the heating and cooling chamber;
- (d) positioning the substrate at a position proximate the heating mechanism;
- (e) heating the substrate with the heating mechanism;
- (f) transferring the substrate from the position proximate the heating mechanism to a position proximate the coolable member;
- and
- (g) cooling the substrate with the coolable member.
13 more elements
Dependencies are inferred from the claim text.