Method for fabricating shallow trench isolation
AssigneeMacronix International Co., Ltd.
InventorWei-Wen Chen
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AssigneeMacronix International Co., Ltd.
InventorWei-Wen Chen
Estimating the term…
A method for forming shallow trench isolation is disclosed. A pad oxide layer and a mask layer are sequentially formed on a substrate. Afterwards, an opening is formed through the mask layer and the pad oxide layer such that regions of the substrate are exposed. Thereafter, the exposed regions are etched to form trenches inside said substrate. Next, nitrogen ions are implanted into the sidewall of the trenches to form a silicon nitride layer, and then a siliconoxynitride layer is formed inside the sidewall of the trenches. Subsequently, a silicon oxide layer is formed on the siliconoxynitride layer and on the mask layer. The excess portion of the silicon oxide layer over said mask layer is removed to expose the mask layer, and then the mask layer is removed away. Finally, the pad oxide layer is removed by using hydrofluoric acid (HF).
A method for forming shallow trench isolation, comprising the steps of:
11 The method of claim 1, wherein the step of removing the excess portion of said silicon oxide layer comprises etch back and chemical mechanical polishing process.
A method for forming shallow trench isolation, comprising the steps of:
A method for forming shallow trench isolation, comprising the steps of:
20 The method of claim 13, wherein the step of removing the excess portion of said silicon oxide layer comprises etch back and chemical mechanical polishing process.
Dependencies are inferred from the claim text.