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US 2002/0001874 A1Published application
Plastic ball grid array assembly
AssigneeIntel Corporation
InventorJoseph C. Barrett
Life of this patent
Estimating the term…
Abstract
An apparatus for enclosing logic chips includes a substrate upon which a logic chip is mounted and a mold cap disposed upon the substrate and covering the logic chip. The mold cap includes at least one extension of sufficient size and shape to provide structural support to a comer section of the substrate.
Claims15
An apparatus for enclosing a logic chip, comprising:
- a substrate having a surface adapted to receive the logic chip mounted thereon;
- and
- a mold cap disposed upon said substrate, said mold cap extending at least partially over said logic chip and including at least one extension of a preselected size and shape extending at least partially into a corner section of said substrate.
A plastic ball grid array assembly comprising:
- a substrate having a generally polygon shape defining at least one comer section;
- a mold cap including at least first and second sections, said first section comprising a generally polygon shaped main body portion covering a portion of said substrate, and said second section comprising an extension of said first section positioned adjacent said corner section of said substrate;
- and
- a logic chip mounted on said substrate and being at least partially covered by the first section of the mold cap.
1 more element
A method for enclosing a logic chip, comprising:
- mounting the logic chip on a polygon shaped substrate;
- and
- forming mold cap on said substrate extending at least partially over said logic chip and into a corner section of said substrate.
Dependencies are inferred from the claim text.