Scribe line structure for preventing from damages thereof induced during fabrication

A scribe line structure of a semiconductor wafer, said semiconductor wafer having a plurality of substantially parallel horizontal scribe lines and a plurality of substantially parallel vertical scribe lines separating a plurality of chips from each other, each parallel horizontal scribe line and each parallel vertical scribe line having two elongated sides and being divided along the elongated sides into a plurality of portions with the same rectangular area, each of the plurality of portions of each scribe line being composed of said scribe line structure, said scribe line structure comprising:

• a multi-layer structure formed over whole area of each portion of each scribe line, said multi-layer structure defining four sides;
• and
• at least two rows of cavities formed along the four sides of said multi-layer structure;
• wherein said cavities are capable of relieving internal stress of the scribe lines and arresting possible cracks induced during scribe line manufacture to prevent from damages of the scribe lines.

A method for fabricating a scribe line structure of a semiconductor wafer, said semiconductor wafer having a plurality of substantially parallel horizontal scribe lines and a plurality of substantially parallel vertical scribe lines separating a plurality of chips from each other, each parallel horizontal scribe line and each parallel vertical scribe line having two elongated sides and being divided into a plurality of portions with the same rectangular area along the two elongated sides, each of the plurality of portions of each scribe line being composed of said scribe line structure, said scribe line structure comprising a multi-layer structure with four sides formed over area of each portion of each scribe line and at least two rows of cavities formed along the four sides of said multi-layer structure, each of said cavities defining a corresponding bottom surface, said method comprising the steps of:

• forming a plurality of conductive layers over whole area of each portion of each scribe line rather than all bottom surfaces to provide said multi-layer structure and said cavities;
• and
• forming a plurality of insulating layers over whole area of each portion of each scribe line rather than all bottom surfaces to provide said multi-layer structure and said cavities;
• wherein said cavities are capable of relieving internal stress of the scribe lines and arresting possible cracks induced during scribe line manufacture to prevent from damages of the scribe lines.