Connection element
OwnerDirk Drescher, Wolfgang Leiberg +3inventors
InventorsDirk Drescher, Wolfgang Leiberg, Rene Tews, Matthias Lehr, Alexander Ruf
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Abstract
The connection element in an integrated circuit has a layer structure arranged between two conductive structures. The layer structure has a dielectric layer which can be destroyed by application of a predetermined voltage. At least one conductive structure is composed of tungsten. The conductive structure adjoins a conductive layer made of tungsten or a tungsten compound, which is a constituent part of the layer structure and which adjoins the dielectric layer.
Claims15
A connection element in an integrated circuit, comprising:
- a layer structure disposed between a first conductive structure composed of tungsten and a second conductive structure;
- said layer structure including a conductive layer formed of a material selected from the group consisting of tungsten and a tungsten compound and adjoining said first conductive structure, and a dielectric layer adjoining said conductive layer and configured to be destroyed by application of a predetermined voltage.
A connection element in an integrated circuit on a substrate, comprising:
- a substrate;
- an interconnect disposed on said substrate;
- an insulating layer disposed on said interconnect;
- a first conductive layer containing tungsten disposed on said insulating layer;
- and
- said insulating layer being configured to be destroyable by applying a predetermined voltage producing a conductive connection between said interconnect and said first conductive layer.
Dependencies are inferred from the claim text.