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US 2001/0055855 A1Published application
Method for sectioning a substrate wafer into a plurality of substrate chips
AssigneeRobert Bosch GmbH
InventorsFrank Fischer, Eckhard Graf
Life of this patent
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Abstract
A method for sectioning a substrate wafer into a plurality of substrate chips enables a process management that is particularly timesaving and flexible with respect to the producible surface areas of the substrate chips. For this purpose, the substrate chips are separated from one another by a selective deep patterning method, a plasma etching method in particular.
Claims10
A method for sectioning a substrate wafer into a plurality of substrate chips, comprising:
- providing a substrate wafer from which a plurality of substrate chips are to be separated;
- and
- separating the plurality of substrate chips from one another by selective deep patterning.
Dependencies are inferred from the claim text.