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AssigneeKoninklijke Philips Electronics N.V.
InventorMARIAN N. WEBSTER
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The invention relates to a method of manufacturing a semiconductor device comprising a semiconductor body (1) having a coil (3) with a magnetic core (4). By means of this method, the surface is provided with a first metallization layer (5) having a first pattern of conduction tracks (6) which are embedded in an insulating material (7, 8, 9). A layer of a magnetic material is provided on the surface (10), which faces away from the semiconductor body. A magnetic core is formed in said layer by means of etching. On the magnetic core and on the adjoining surface of the first metallization layer, a second metallization layer (11) with a second pattern of embedded conduction tracks is formed in an insulating material (13, 14). The second pattern is connected to the first pattern in such a way that windings of the coil are formed. The first metallization layer is formed on the surface of the semiconductor body in such a manner that the surface of the metallization layer facing away from the semiconductor body is planar. The layer of magnetic material having a thickness below 50 nm is subsequently provided. The method in accordance with the invention enables coils to be manufactured which exhibit a relatively high self-induction when used at frequencies above 100 MHz.
A method of manufacturing a semiconductor device comprising a semiconductor body having a surface which is provided with a coil having a magnetic core, in which method, the surface of the semiconductor body is provided with a first metallization layer having a first pattern of conductor tracks embedded in insulating material, and a surface, which faces away from the semiconductor body, on which a layer of a magnetic material is deposited in which the magnetic core is formed by means of an etch treatment, whereafter the magnetic core and the adjacent surface of the first metallization layer are provided with a second metallization layer having a second pattern of conductor tracks embedded in an insulating material, said second pattern of conductor tracks being connected to the first pattern of conductor tracks so as to form windings of the coil, characterized in that the first metallization layer is formed on the surface of the semiconductor body in such a manner that the surface of said metallization layer facing away from the semiconductor body is flat, whereafter the layer of a magnetic material is deposited in a thickness below 50 nm.
Dependencies are inferred from the claim text.