Polishing composition
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorsCraig D. Lack, Terence M. Thomas, Qianqiu Ye
Life of this patent
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Abstract
A polishing composition to remove metal from a dielectric layer by, either single step CMP polishing, or two step CMP polishing, the composition including, an aqueous solution provided with a substance having molecules with respective silanols, and a concentration of ions that solublize the silanols to adsorb on a hydrated surface of the dielectric layer during said polishing.
Claims27
A polishing composition for polishing with a polishing pad to remove metal from an underlying dielectric layer on a semiconductor substrate, the composition comprising:
- an aqueous solution provided with a substance having molecules with respective silanols, and
- the aqueous solution having a concentration of ions that form soluble silanols on the molecules, and further wherein, the soluble silanols adsorb on the surface of the dielectric layer that becomes hydrated by the polishing composition during said polishing.
A method for polishing a semiconductor substrate with a polishing pad and a polishing composition to remove metal from an underlying dielectric layer on the semiconductor substrate, the method comprising the steps of:
- providing the polishing composition as an aqueous solution that is provided with a substance having molecules with respective silanols, and provided with a concentration of ions that form respective soluble silanols on the molecules, and
- adsorbing the soluble silanols on the surface of the dielectric layer that becomes hydrated by the polishing composition during said polishing.
An abrasive free polishing composition for polishing with a polishing pad having abrasive particles to remove metal from an underlying dielectric layer on a semiconductor substrate, the composition comprising:
- an aqueous solution provided with a substance having molecules with respective silanols, and
- the aqueous solution having a concentration of ions that form soluble silanols on the molecules, and further wherein, the soluble silanols adsorb on the surface of the dielectric layer that becomes hydrated by the polishing composition during said polishing.
A method for polishing a semiconductor substrate with a polishing pad and a polishing composition to remove metal from an underlying dielectric layer on the semiconductor substrate, the method comprising the steps of:
- providing the polishing composition aqueous solution with a substance having molecules with respective silanols, and with a concentration of ions that form respective soluble silanols on the molecules,
- polishing the semiconductor substrate with the polishing composition and with the polishing pad having abrasive particles, and
- adsorbing the soluble silanols on the surface of the dielectric layer that becomes hydrated by the polishing composition during said polishing.
Dependencies are inferred from the claim text.