Sensor having membrane structure and method for manufacturing the same
AssigneeDenso Corporation
InventorInao Toyoda
Life of this patent
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Abstract
In a sensor having a membrane structure, a sensor chip (silicon substrate) is provided with a through hole that is open on both upper and lower surfaces of the silicon substrate. A sensor element having a membrane structure is formed on the upper surface of the silicon substrate to close the through hole on the upper surface. The lower surface of the silicon substrate is bonded to a stem through adhesive to define a communication passage through which an inside and an outside of the through hole communicate with each other. Accordingly, the sensor can exhibit high reliability.
Claims9
A sensor comprising:
- a base;
- a semiconductor substrate having a through hole that is open on both first and second surfaces of the semiconductor substrate, the semiconductor substrate being bonded to the base at the first surface;
- and
- a sensor element having a membrane structure and formed on the second surface of the semiconductor substrate, the membrane structure closing an open portion of the through hole on the second surface, wherein:
- the first surface of the semiconductor substrate defines a communication passage with the base;
- and
- an inside and an outside of the through hole communicate with each other through the communication passage.
A method for manufacturing a sensor, comprising:
- preparing a semiconductor substrate having a through hole, and a sensor element formed on a main surface thereof and having a membrane structure, the through hole being closed by the membrane structure on the main surface and being open on a back surface of the semiconductor substrate;
- preparing a base having a bonding area;
- and
- bonding the back surface of the semiconductor substrate to the bonding area of the base to define a communication passage between the back surface and the bonding area of the base, whereby an inside of the through hole communicates with an outside of the through hole through the communication passage.
Dependencies are inferred from the claim text.