Method of manufacturing semiconductor device and tray used in the method

A method of manufacturing a semiconductor device with storing semiconductor devices in storage portions of built-up type trays having a plurality of storage portions on both front and rear surfaces to perform preservation, transportation, characteristic selection, inspection, a baking process, or shipping for the semiconductor devices, comprising:

• the step of preparing the plurality of trays each having a tray body portion for connecting the plurality of storage portions;
• and cushioning portions arranged on bottom portions which are contact positions between the storage portions and the semiconductor devices and formed of a material softer than the tray body portion;
• the step of arranging the semiconductor devices in the storage portions of the trays to support surfaces of the semiconductor devices on a mounting side of the body portion with the cushioning portions;
• and
• the step of building up the tray and another tray which can be built up on the tray and arranging the cushioning portions of the tray and the other tray on both of front and rear surface sides of the semiconductor devices in the storage portions of the tray to store the semiconductor devices.

A method of manufacturing a semiconductor device with storing semiconductor devices in storage portions of built-up type trays having a plurality of storage portions on both front and rear surfaces to perform preservation, transportation, characteristic selection, inspection, a baking process, or shipping for the semiconductor devices, comprising:

• the step of preparing the plurality of trays each having a tray body portion for connecting a plurality of storage portions;
• and cushioning portions arranged on bottom portions and inner walls which are contact positions between the storage portions and the semiconductor devices and formed of a material softer than the tray body portion;
• the step of arranging the semiconductor devices in the storage portions of the tray and supporting surfaces or external terminals of the semiconductor devices on a mounting side of the body portion with the cushioning portions;
• and
• the step of building up the tray and another tray which can be built up on the tray and arranging the cushioning portions of the tray and the other tray on both of front and rear surface sides of the semiconductor devices in the storage portions of the tray to store the semiconductor devices.

A method of manufacturing a semiconductor device with storing semiconductor devices in storage portions of built-up type trays having a plurality of storage portions on both front and rear surfaces to perform preservation, transportation, characteristic selection, inspection, a baking process, or shipping for the semiconductor devices, comprising:

• the step of preparing a plurality of trays each having a tray body portion for connecting a plurality of storage portions;
• and cushioning portions arranged at contact positions between the storage portions and the semiconductor devices and formed of a resin material having a degree of hardness lower than that of the tray body portion;
• the step of arranging the semiconductor devices in the storage portions of the tray and supporting the semiconductor devices with the cushioning portions;
• and
• the step of building up the tray and another tray which can be built up on the tray and arranging the cushioning portions of the tray and the other tray on both of front and rear surface sides of the semiconductor devices in the storage portions of the tray to store the semiconductor devices.

A method of manufacturing a semiconductor device with storing semiconductor devices having ball electrodes as external terminals in storage portions of built-up type trays having a plurality of storage portions on both front and rear surfaces to perform preservation, transportation, characteristic selection, inspection, a baking process, or shipping for the semiconductor devices, comprising:

• the step of preparing a plurality of trays each having a tray body portion for connecting a plurality of storage portions;
• and cushioning portions arranged at contact positions between the storage portions and the semiconductor devices and formed of a material softer than the tray body portion;
• the step of arranging the semiconductor devices in the storage portions of the trays to support the semiconductor devices with the cushioning portions;
• and
• the step of building up the tray and another tray which can be built up on the tray and arranging the cushioning portions of the tray and the other tray on both of front and rear surface sides of the semiconductor devices in the storage portions of the tray to store the semiconductor devices.

A method of manufacturing a semiconductor device with storing semiconductor devices having gull-wing outer leads as external terminals in storage portions of built-up type trays having a plurality of storage portions on both front and rear surfaces to perform preservation, transportation, characteristic selection, inspection, a baking process, or shipping for the semiconductor devices, comprising:

• the step of preparing a plurality of trays each having a tray body portion for connecting a plurality of storage portions;
• and cushioning portions arranged to position the semiconductor devices in the storage portions and formed of a material softer than the tray body portion;
• the step of arranging the cushioning portions inside the gull-wing outer leads of the semiconductor devices and of positioning the semiconductor devices with the cushioning portions to store the semiconductor devices in the storage portions of the tray;
• and
• the step of building up the tray and another tray which can be built up on the tray and of storing the semiconductor devices in the storage portions of the respective trays.

A tray having a plurality of recessed storage portions, comprising:

• a tray body portion for connecting a plurality of storage portions in which semiconductor devices are stored;
• and
• cushioning portions arranged in the storage portions and formed of a material softer than the tray body portion;
• wherein when the tray and another tray which can be built up on the tray while the semiconductor devices are stored in the storage portions of the tray, the cushioning portions are arranged on both front and rear surface sides of the semiconductor devices, and the cushioning portions on at least one of both the front and rear surface sides are in contact with the semiconductor devices.