Back to results
US 2001/0026953 A1Published application
High frequency component and communication apparatus incorporating the same
AssigneeMurata Manufacturing Co., Ltd.
InventorsTomonori Ito, Norio Yoshida, Takahiro Watanabe
Life of this patent
Estimating the term…
Abstract
A high frequency component minimizes changes in the inductance of a chip coil mounted on a substrate such that stable characteristics are obtained. In the high frequency component, chip components including the chip coil are mounted on the substrate. A hole is provided in a portion of a metal cover positioned above the chip coil when the metal cover covers the top portion of the substrate.
Claims17
A high frequency component comprising:
- a substrate;
- high frequency circuit components including a chip coil mounted on the substrate;
- a metal cover for covering the top of the substrate;
- and
- a hole provided in a portion of the metal cover in the vicinity of the chip coil.
2 more elements
A high frequency component comprising:
- a substrate;
- high frequency circuit components including at least one chip coil mounted on the substrate;
- a metal cover for covering the top of the substrate;
- and
- a hole provided in a portion of the metal cover in the vicinity of the at least one chip coil.
2 more elements
Dependencies are inferred from the claim text.