Method of metalizing a semiconductor power device ceramic member

A method of depositing an aluminum film on a ceramic component of an integrated circuit package with plural surfaces in a vapor deposition chamber comprising the steps of:

• (A) providing a vapor deposition-chamber;
• (B) placing the ceramic component in the chamber;
• (C) drawing a vacuum in the chamber;
• (D) filling the chamber with argon to a pressure of a few millitorr;
• (E) continuously providing vaporized aluminum in the chamber by feeding aluminum wire to a heating crucible to thereby vaporize the aluminum wire;
• (F) forming a glow discharge around the object by primarily applying a negative bias voltage to a frame surrounding the ceramic component an amount of the argon being ionized by the applied negative voltage being sufficient to ionize the vaporized aluminum passing through the glow discharge;
• (G) ionizing the vaporized aluminum by passage of the aluminum through the argon by the applied voltage, and
• (H) depositing on all of the plural surfaces of the ceramic component the ionized aluminum ions simultaneously from plural directions to thereby deposit the aluminum film uniformly on the ceramic object.

A method of adhering a metal film to a ceramic component for an integrated circuit package comprising the steps of:

• (A) providing a vapor deposition chamber;
• (B) placing the ceramic component in the chamber;
• (C) drawing a vacuum in the chamber;
• (D) filling the chamber with an inert gas to a pressure of a few millitorr;
• (E) continuously providing vaporized metal in the chamber by feeding metal wire to a heating crucible to thereby vaporize the metal wire;
• (F) forming a glow discharge around the ceramic component primarily by applying a negative bias voltage to a frame surrounding the ceramic component to ionize the inert gas within the chamber;
• (G) ionizing the vaporized metal by passage of the metal through the ionized inert gas, and
• (H) depositing on all surfaces of the ceramic component the ionized metal ions simultaneously from plural directions to thereby deposit the metal film uniformly on the ceramic component.