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AssigneeTokyo Electron Limited
InventorsHideyuki Takamori, Kiyohisa Tateyama, Kengo Mizosaki, Noriyuki Anai, Mitsuhiro Sakai, Shinobu Tanaka, Yoichi Honda, Yuji Shimomura
Estimating the term…
Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.
A substrate process method for heating and drying resist solution coated on a substrate to be processed before an exposing process and a developing process are performed, comprising the steps of:
A substrate process method for forming a particular film on a front surface of a substrate, comprising the steps of:
A substrate process apparatus for coating a particular film on a front surface of a substrate, comprising:
A substrate process apparatus for forming a particular film on a front surface of a substrate, comprising:
A substrate process apparatus for forming a particular film on a front surface of a substrate, comprising:
Dependencies are inferred from the claim text.