US 2001/0026440 A1 · EMI reduction device and assembly

Abstract

An EMI reduction device coupled between to a printed circuit board (PCB) assembly and a heat sink is herein disclosed. The PCB assembly includes a processor core that is the source of unintentional electromagnetic interference (EMI). The EMI reduction device is attached to a heat sink which is positioned over the processor core such that it capacitively couples emissions from the processor core to a grounding plane resident in the PCB assembly, thereby reducing the unintentional EMI. Simultaneously, the EMI reduction device is able to maintain thermal contact with the heat sink.

Claims15

Dependent claims

An electronic assembly apparatus, comprising:

a circuit board having a top surface and a bottom surface, the circuit board including an electronic device emanating electromagnetic emissions;
an EMI reduction device that is coupled to the circuit board, the EMI reduction device is positioned around the outer periphery of the electronic device, the EMI reduction device touches the circuit board at contact points that surround the electronic device, the EMI reduction device has no physical contact with the electronic device;
and
a thermal dissipation device that is coupled to the EMI reduction device and the circuit board, the thermal dissipation device is positioned over the top surface of the circuit board;
wherein the thermal dissipation device dissipates heat generated from the circuit board;
wherein the EMI reduction device reduces electromagnetic emissions generated from the electronic device.

3 more elements

Dependencies are inferred from the claim text.

EMI reduction device and assembly

Life of this patent

EMI reduction device and assembly

Life of this patent

Abstract

Claims15