Substrate processing method and substrate processing apparatus

A substrate processing method, comprising the steps of:

• rotating a substrate which is horizontally held;
• and
• supplying a processing solution and a rinse solution from a processing solution supply nozzle and a rinse solution supply nozzle respectively to the rotating substrate while moving the processing solution supply nozzle and the rinse solution supply nozzle along a direction in which an outer edge portion and a central portion of the substrate are linked,
• wherein the rinse solution supply nozzle is positioned in a direction in which the processing solution supplied onto the substrate spreads.

A substrate processing method, comprising the steps of:

• rotating a substrate which is horizontally held;
• and
• supplying a processing solution and a rinse solution from a processing solution supply nozzle and a rinse solution supply nozzle respectively to the rotating substrate while moving the processing solution supply nozzle and the rinse solution supply nozzle along a direction in which an outer edge portion and a central portion of the substrate are linked,
• wherein the rinse solution removes the used processing solution after the processing solution supplied onto the substrate is used.

A substrate processing apparatus, comprising:

• a substrate holding mechanism for horizontally holding a substrate;
• a rotating mechanism for rotating the substrate in a horizontal plane;
• a processing solution supply nozzle moving along a direction, in which an outer edge portion and a central portion of the substrate are linked, to supply a processing solution onto the substrate while the substrate is being rotated by the rotating mechanism;
• and
• a rinse solution supply nozzle, disposed adjacent to the processing solution supply nozzle so as to be positioned in a spreading direction of the processing solution supplied onto the substrate, for supplying a rinse solution onto the substrate simultaneously with the supply of the processing solution.

A substrate processing apparatus, comprising:

• a substrate holding mechanism for horizontally holding a substrate;
• a rotating mechanism for rotating the substrate in a horizontal plane;
• a processing solution supply nozzle moving along a direction, in which an outer edge portion and a central portion of the substrate are linked, to supply a processing solution onto the substrate while the substrate is being rotated by the rotating mechanism;
• and
• a rinse solution supply nozzle for supplying a rinse solution for removing the used processing solution after the processing solution supplied onto the substrate is used for processing onto the substrate simultaneously with the supply of the processing solution.

A substrate processing apparatus, comprising:

• a holder for holding a substrate;
• a first nozzle for supplying a first solution onto the held substrate;
• a second nozzle for supplying at least one of a second solution and a gas onto the held substrate;
• and
• a moving mechanism for moving a supply position of the first nozzle and moving the second nozzle so that the first solution which has been just supplied from the first nozzle is removed by at least one of the second solution and the gas supplied from the second nozzle.