Method and apparatus for loading substrate in semiconductor manufacturing apparatus

A method of loading a substrate in a semiconductor manufacturing apparatus for applying predetermined processing to the substrate, in which the substrate is carried into a vacuum-processing chamber and loaded on a heated or cooled table, and which is provided with lift pins for loading the substrate on said table and a drive mechanism for raising and lowering said lift pins, comprising;

• placing the substrate carried into said vacuum-processing chamber by a transport robot on to said lift pins moved to an ascended position,
• taking a sufficient time for lowering said lift pins so that a temperature difference between said table and the substrate at the time of loading the substrate on said table becomes less than a predetermined temperature, and
• loading the substrate on said table afterward.

An apparatus device for loading a substrate in a semiconductor manufacturing apparatus in which the substrate is carried into a vacuum-processing chamber and loaded on a heated or cooled table placed in said chamber, and applied with a predetermined processing, and is provided with lift pins for loading the substrate on said table and a drive mechanism for raising and lowering said lift pins, comprising;

• a first thermometer for measuring a temperature of the substrate,
• a second thermometer for measuring a temperature of the table, and
• a controller for receiving signals output by said first thermometer and second thermometer, and controlling the operation of said drive mechanism, based on the temperature information of the substrate and table, so as to cause sufficient time to elapse when lowering said lift pins so that a temperature difference between said table and the substrate at the time of loading the substrate becomes less than a predetermined temperature, and then load the substrate on said table.