Method for regenerating semiconductor wafers
AssigneeInfineon Technologies AG
InventorsHans Kramer, Matthias Taubert, Gernot Loibnegger
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Abstract
A process is described for recycling test wafers used for quality control or damaged wafers used in the context of chip production by regenerative removal of the previously applied layers. The method is based on the object of developing a cost-effective, environmentally friendly and time-saving regeneration method. The object is achieved by removing the applied layers by wet blasting using a specific blast material.
Claims9
A method for regenerating semiconductor wafers used in tests for process and equipment control purposes and for other semiconductor wafers having damaged surfaces, which comprises the steps of:
- regenerating a wafer used in circuit fabrication by removing previously applied layers on the wafer, the previously applied layers being removed by wet blasting using a blast material finely distributed in water and having a predetermined and substantially uniform granularity.
Dependencies are inferred from the claim text.