Cooling device for a high-power semiconductor module
AssigneeABB Schweiz AG
InventorStefan Kaufmann
Life of this patent
Estimating the term…
Abstract
A cooling device for a high-power semiconductor module has a cooler lower part (1) and a cooler upper part (2), with the cooler upper part (2) being connected to the cooler lower part (1) by an integral material connection. The cooler upper part (2) has a cooling plate (20) composed of metal matrix composite, for at least one semiconductor component (4) to be fitted to. A metal border (21) is integrally formed on the cooling plate (20) in order to allow an integral material connection between the cooler upper part (2) and the cooler lower part (1). This results in a cooling device which can be produced easily and whose cost is low.
Claims10
A cooling device for a high-power semiconductor module,
- with the cooling device have a cooler lower part (1) and a cooler upper part (2),
- with the cooler upper part (2) being connected to the cooler lower part (1) by an integral material connection, and
- with the cooler upper part (2) having a cooling plate (20) composed of a metal matrix composite, for at least one semiconductor component (4) to be placed on it,
- wherein
- a metal border (21) is integrally formed on the cooling plate (20), and in that the integral material connection between the cooler upper part (2) and the cooler lower part (1) is produced via the metal border (21).
A method for producing a cooling device for a high-power semiconductor module,
- with a cooler lower part (1) and a cooler upper part (2) being formed, and the cooler upper part (2) and the cooler lower part (1) being connected to one another by an integral material connection,
- wherein
- in order to form the cooler upper part (2) a cooling plate (20) is produced from a metal matrix composite and a metal border (21) is integrally formed on it, and in that the cooler upper part is connected to the cooler lower part (1) by means of the metal border.
Dependencies are inferred from the claim text.