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US 12,772,876 B2Granted
Multi-die communications couplings using a single bridge die
AssigneeAdvanced Micro Devices, Inc.
InventorsRahul Agarwal, Raja Swaminathan, John Wuu, Mihir Pandya, Samuel D. Naffziger
Life of this patent
Estimating the term…
Abstract
A chip for multi-die communications couplings using a single bridge die, includes: a plurality of dies each including one or more functional circuit blocks; and a first bridge die directly communicatively coupling two or more pairs of dies of the plurality of dies.
Claims20
A chip for multi-die communications couplings using a single bridge die, comprising:
- a plurality of dies each comprising one or more functional circuit blocks and a first side mounted to back-end-of-line (BEOL) structures and configured to be coupled to a substrate;
- a first bridge die coupling two or more pairs of dies of the plurality of dies, wherein the first bridge die is mounted on a second opposite side of the plurality of dies, opposite from the BEOL structures, wherein the two or more pairs of dies comprise a first pair of non-adjacent dies and a second pair of non-adjacent dies, and wherein communication paths in the first bridge die coupling the first pair and the second pair are non-overlapping.
A method for multi-die communications couplings using a single bridge die, the method comprising:
- coupling, via a first bridge die, two or more pairs of dies in a plurality of dies, wherein each of the plurality of dies comprises one or more functional circuit blocks and a first side mounted to back-end-of-line (BEOL) structures and configured to be coupled to a substrate, and wherein the first bridge die is mounted on a second opposite side of the plurality of dies, opposite from the BEOL structures, wherein the two or more pairs of dies comprise a first pair of non-adjacent dies and a second pair of non-adjacent dies, and wherein communication paths in the first bridge die coupling the first pair and the second pair are non-overlapping;
- at least partially encapsulating the plurality of dies and the first bridge die to create an encapsulated component group;
- and
- bonding the encapsulated component group to a carrier wafer.
1 more element
An apparatus for multi-die communications couplings using a single bridge die comprising:
- computer memory;
- and
- a system-on-chip operatively coupled to the computer memory, wherein the system-on-chip comprises:
- a plurality of dies each comprising one or more functional circuit blocks and a first side mounted to back-end-of-line (BEOL) structures and configured to be coupled to a substrate;
- a first bridge die coupling two or more pairs of dies of the plurality of dies, wherein the first bridge die is mounted on a second opposite side of the plurality of dies, opposite from the BEOL structures, wherein the two or more pairs of dies comprise a first pair of non-adjacent dies and a second pair of non-adjacent dies, and wherein communication paths in the first bridge die coupling the first pair and the second pair are non-overlapping.
2 more elements
Dependencies are inferred from the claim text.