Cooling for back side power distribution network
AssigneeInternational Business Machines Corporation
InventorsQianwen Chen, Joshua M. Rubin, Ruilong Xie, Tao Li
Life of this patent
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Abstract
An electrical device that includes thermal cooling through silicon vias (TSVs) and micro-channels embedded in the carrier wafer for back side power distribution networks (BSPDN). The carrier wafer is at one end of a stacked structure providing the electrical device. At least one active device layer in the stacked structure that is present a level of the electrical device that is separate from a level containing the thermal cooling through silicon vias (TSVs) and micro-channels.
Claims20
An electrical device comprising:
- a first die level including first thermal cooling through silicon vias (TSV) in contact with fluidic channels;
- and
- a second die level including second thermal cooling TSV and electrical connection TSV, wherein at least one active device layer is in a level of the electrical device that is separate from a level containing the first thermal cooling TSV, the second thermal cooling TSV and the electrical connection TSV.
An electrical device comprising:
- a fluidic channel level including thermal cooling through silicon vias (TSV) embedded through a silicon-containing layer, wherein a cap layer for the fluidic channel level includes an opening therethrough to channels containing the thermal cooling TSV;
- and
- at least one active device layer is in a level of the electrical device that is separate from a level containing the thermal cooling TSV.
An electrical device comprising:
- thermal cooling through silicon vias (TSV) embedded through a silicon-containing layer and in contact with fluidic channels, wherein the silicon-containing layer is at one end of a stacked structure providing the electrical device;
- and
- at least one active device layer in the stacked structure that is present in a level of the electrical device that is separate from a level containing the thermal cooling TSV.
Dependencies are inferred from the claim text.