Vibration dampener using array of vertical O-rings

A semiconductor processing system, comprising:

• a workpiece holder;
• and
• a vibration dampening system used to couple a first component and a second component, the vibration dampening system comprising:
• a flange attached to a lower end of the second component;
• a retaining clamp surrounding the flange and affixed to the first component;
• and
• vertically oriented O-rings disposed between a lower surface of the retaining clamp and an upper surface of the flange or between a lower surface of the flange and an upper surface of the first component to dampen vibrations from the first component to the second component.

An semiconductor processing system, comprising:

• a workpiece holder;
• and
• a vibration dampening system for coupling a bushing to a second component, comprising:
• vertically oriented O-rings disposed between an inner surface of the bushing and an outer surface of the second component to dampen vibrations from the bushing to the second component.