Method for manufacturing semiconductor apparatus and semiconductor manufacturing apparatus comprising amorphous layer between wafer and ring-shaped frame

Abstract

According to the present disclosure, A method for manufacturing a semiconductor apparatus bonds a ring-shaped frame to an outer peripheral portion of a wafer, and comprises the steps of installing one of the wafer and the frame on a stage, holding another of the wafer and the frame in a chuck part in a pressure-bonding mechanism, activating a surface layer of the outer peripheral portion of the wafer and a surface layer of the frame by atom irradiation, and sandwiching the wafer and the frame between the stage and the chuck part and pressure-bonding the activated surface layers of the wafer and the frame using the pressure-bonding mechanism. An amorphous layer is formed on a bonding interface between the wafer and the frame pressure-bonded to each other.

Dependencies are inferred from the claim text.