Circuit board assembly manufacturing method, circuit board assembly manufactured by same, and electric vehicle including same
AssigneeLG Energy Solution, Ltd.
InventorsBum Jick Lee, Young Su Son
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AssigneeLG Energy Solution, Ltd.
InventorsBum Jick Lee, Young Su Son
Estimating the term…
The present invention relates to a method for manufacturing a circuit board assembly, which includes: mounting a plurality of components on a circuit board; preparing a mold comprising a concave portion corresponding to a shape of each of the plurality of components and a convex portion corresponding to a surface of the circuit board; providing the mold at an upper side of the circuit board and preparing a protective material to be disposed on the circuit board; disposing the protective material on the circuit board and the components by using the mold; and curing the protective material to form a protective layer.
A method for manufacturing a circuit board assembly, the method comprising:
Dependencies are inferred from the claim text.