Apparatus, system, and method for backdrilling vias based on depth measurements taken during primary drilling applications
AssigneeHewlett Packard Enterprise Development LP
InventorDaniel J Prezioso
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AssigneeHewlett Packard Enterprise Development LP
InventorDaniel J Prezioso
Estimating the term…
A system for backdrilling vias based on depth measurements taken during primary drilling applications is disclosed. This system may include a drilling machine configured to drill holes into circuit boards via a conductive drill bit and circuitry communicatively coupled to the drilling machine. The circuitry may be configured to measure a depth of a ground layer within a circuit board based at least in part on contact made between the conductive drill bit and the ground layer. Additionally or alternatively, the circuitry may be configured to calculate a depth of an electrical layer located proximate to the ground layer within the circuit board based at least in part on the depth of the ground layer to avoid drilling into the electrical layer. Various other apparatuses, systems, and methods are also disclosed.
A system comprising:
An apparatus comprising:
A method comprising:
Dependencies are inferred from the claim text.