Negative photosensitive composition and method for producing hollow structure

A negative photosensitive composition for forming a top plate portion of a hollow structure, the negative photosensitive composition comprising:

• an epoxy group-containing compound;
• a cationic polymerization initiator;
• a polyfunctional (meth)acrylate compound;
• and
• a photoradical polymerization initiator,
• wherein the epoxy group-containing compound is selected from the group consisting of an epoxy resin represented by General Formula (anv0), a resin having a constitutional unit represented by General Formula (anv1) and a compound represented by Chemical Formula (A3-1),
• wherein a content of the epoxy group-containing compound is 50 parts by mass or more with respect to 100 parts by mass of a total content of the epoxy group-containing compound and the polyfunctional (meth)acrylate compound,
• wherein Rp1 and Rp2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, a plurality of Rp1's may be the same or different from each other, a plurality of Rp2's may be the same or different from each other, n1 is an integer of 1 to 5, REP is an epoxy group-containing group, and a plurality of REP's may be the same or different from each other
• wherein REP is an epoxy group-containing group, and Ra22 and Ra23 are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogen atom,