Back to results
US 12,767,855 B2Granted
Polishing compositions and methods of use thereof
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsYannan Liang, Bin Hu, Hsin Hsien Lu
Life of this patent
Estimating the term…
Abstract
This disclosure relates to polishing compositions containing at least one abrasive, at least one organic acid or a salt thereof, at least one organic solvent in an amount of from about 3% to about 50% by weight of the composition, and an aqueous solvent.
Claims19
A polishing composition, comprising:
- at least one abrasive in an amount of from about 0.1% to about 12% by weight of the composition;
- at least one organic acid or a salt thereof in an amount of from about 0.01% to about 1% by weight of the composition;
- at least one organic solvent in an amount of from about 4% to about 15% by weight of the composition;
- at least one non-ionic surfactant in an amount of from about 0.001% to about 1% by weight of the composition, wherein the at least one non-ionic surfactant comprises an alcohol alkoxylate, wherein the alkoxylate groups of the alcohol alkoxylate are propoxylate groups or a combination of ethoxylate and propoxylate groups;
- and
- an aqueous solvent in an amount of from about 70% to about 90% by weight of the composition,
- wherein the polishing composition has a pH of from about 7 to about 13.
4 more elements
Dependencies are inferred from the claim text.