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US 12,765,396 B2Granted
Semiconductor leadframe packages and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsLijuan Wang, Ian Ceazar Bucayon Barias, Sen Sun
Life of this patent
Estimating the term…
Abstract
In implementations of a leadframe for a semiconductor package, the leadframe may include a die attach pad including a swag area; and one or more leads. The swag area may include an alternating pattern therein including at least two raised features, where each of the at least two raised features may be configured to support a clamping finger during a wirebonding process.
Claims18
A leadframe for a semiconductor package, the leadframe comprising:
- a die attach pad comprising a swag area;
- and
- one or more leads;
- wherein the swag area comprises an alternating pattern therein comprising at least two raised features and two downset features, the at least two raised features comprising a surface coplanar with a surface of the die attach pad, the surface of each of the at least two raised features configured to contact a clamping finger during a wirebonding process.
1 more element
A leadframe for a semiconductor package, the leadframe comprising:
- a die attach pad comprising a swag area;
- and
- one or more leads;
- wherein the swag area comprises an alternating pattern of indentations therein;
- and
- wherein the die attach pad is configured to receive a die thereon between the swag area extending along two opposing sides of the die attach pad.
3 more elements
A leadframe for a semiconductor package, the leadframe comprising:
- a die attach pad comprising a swag area;
- and
- one or more leads;
- wherein the swag area comprises a pattern comprising alternating raised features and downset features;
- wherein the downset features comprise a mold lock.
2 more elements
Dependencies are inferred from the claim text.