Semiconductor chip, semiconductor device including semiconductor chips, and method of inspecting the semiconductor device

A semiconductor device, comprising:

• a silicon substrate having a first surface and a second surface opposite to the first surface, the silicon substrate including a plurality of circuit pattern regions and a peripheral region between the plurality of circuit pattern regions;
• an activation layer on the second surface of the silicon substrate, the activation layer having a plurality of circuit patterns respectively in the plurality of circuit pattern regions;
• and
• a plurality of scattering detection patterns in the peripheral region, each of the plurality of scattering detection patterns having a plurality of circuit cells configured to generate a leakage current based on a scattered beam or heat of a laser.

A semiconductor chip, comprising:

• a semiconductor substrate having a first surface and a second surface opposite to the first surface, the semiconductor substrate including a circuit pattern region and a peripheral region surrounding the circuit pattern region;
• an activation layer on the second surface of the semiconductor substrate, the activation layer having a plurality of circuit patterns in the circuit pattern region;
• and
• at least one scattering detection pattern in the peripheral region, the at least one scattering detection pattern having a plurality of circuit cells configured to generate leakage current based on a scattered beam or heat of a laser,
• wherein the plurality of circuit cells are arranged in a grid shape, and
• wherein each circuit cell of the plurality of circuit cells includes a transistor and a capacitor.