Heat dissipation apparatus and server

A server, comprising a mainboard, a chip disposed on the mainboard, and a heat dissipation apparatus, wherein

• the heat dissipation apparatus is configured to dissipate heat for the chip;
• wherein the heat dissipation apparatus is configured to dissipate heat for the chip, and comprises a cover plate, a flow distribution plate, and a heat dissipation member, wherein
• a first flow inlet and a first flow outlet are disposed in the cover plate, a flow inlet cavity and a flow outlet cavity that are isolated from each other are disposed in the cover plate, the first flow inlet is configured to communicate with the flow inlet cavity, the first flow outlet is configured to communicate with the flow outlet cavity, and the cover plate is connected to a top face of the flow distribution plate in a sealed manner;
• the heat dissipation member is connected to a bottom face of the flow distribution plate in a sealed manner, the heat dissipation member and the flow distribution plate form a sealed cavity, the heat dissipation member comprises a heat dissipation portion, the heat dissipation portion is located in the sealed cavity, and a heat dissipation flow channel is formed in the heat dissipation portion;
• a second flow inlet and at least two second flow outlets are provided in the flow distribution plate, the second flow inlet is configured to communicate with the flow inlet cavity and the heat dissipation flow channel, and the second flow inlet is located between two ends of the heat dissipation flow channel;
• and
• two of the at least two second flow outlets are respectively located at the two ends of the heat dissipation flow channel, and the at least two second flow outlets communicate with the heat dissipation flow channel and the flow outlet cavity.