Vacuum wafer chuck for manufacturing semiconductor devices

A semiconductor manufacturing system, comprising:

• a substrate holder, wherein the substrate holder is configured with at least one pin;
• and
• a substrate displacing assembly for displacing a substrate on the substrate holder in a first direction perpendicular to a top surface of the substrate holder through the at least one pin,
• wherein the substrate displacing assembly comprises at least one load fork, a coupler and a driving shaft, wherein the at least one load fork comprises a fork region and a base region, wherein the coupler is mechanically coupled to the base region through at least one first joining screw extending in the first direction, wherein the coupler is further mechanically coupled to the driving shaft through a second joining screw extending in the first direction, and
• wherein a clearance distance in a second direction, perpendicular to the first direction, between an inner wall of the coupler to a side wall of the driving shaft is greater than 0.1 millimeters.

A method for handling a semiconductor substrate, comprising:

• providing a substrate holder;
• providing a substrate displacing assembly for displacing a semiconductor substrate on the substrate holder in a first direction perpendicular to a top surface of the substrate holder
• displacing the semiconductor substrate using the substrate displacing assembly in a first direction;
• and
• performing a semiconductor manufacturing process on the semiconductor substrate,
• wherein the substrate displacing assembly comprises, a pair of load forks, a coupler, and a driving shaft,
• wherein the pair of load forks comprises a fork region and a base region, wherein the coupler is mechanically coupled to the base region, and the driving shaft is mechanically coupled to the coupler, and
• wherein a clearance distance in a second direction, perpendicular to the first direction, between an inner wall of the coupler to a side wall of the driving shaft is greater than 0.1 millimeters.