Modular wafer-chuck system
AssigneeATT Advanced Temperature Test Systems GmbH
InventorMarkus Eibl
Life of this patent
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Abstract
A modular wafer-chuck system is provided for mounting or clamping and temperature control of a wafer. The modular wafer-chuck system includes: a chuck for temperature control of a wafer; and a sensor module with at least one temperature-measuring apparatus for measuring a temperature of the sensor module and/or of the chuck and/or of a wafer mounted or clamped by the wafer-chuck system. The chuck has a coupling surface configured to detachably couple the sensor module, and the sensor module has a coupling surface configured to mount or clamp a wafer.
Claims15
A modular wafer-chuck system (40) for mounting or clamping and temperature control of a wafer (2), comprising:
- a chuck (1) for temperature control of a wafer (2);
- a sensor module (42) comprising at least one temperature-measuring means (6) for measuring a temperature of the sensor module (42) and/or of the chuck (1) and/or of a wafer (2) mounted or clamped by the wafer-chuck system;
- wherein the chuck (1) has a coupling surface (1a) configured to detachably couple the sensor module (42);
- and
- wherein the sensor module (42) has a first coupling surface (42a) configured to mount or clamp a wafer (2), and a second coupling surface (42b) for coupling with the coupling surface (1a) of the chuck (1) with the aid of a negative pressure and/or a vacuum and/or an applied magnetic field;
- and
- wherein the first coupling surface (42a) of the sensor module (42) is arranged on a side of the sensor module (42) facing away from the chuck (1).
A sensor module (42) for coupling to a chuck (1) of a modular wafer-chuck system (40), comprising:
- at least one temperature-measuring means (6) for measuring a temperature of the sensor module (42) and/or of a coupled chuck (1) and/or of a wafer (2) mounted or clamped by the sensor module (40) and/or by the chuck (1);
- a first coupling surface (42a) for mounting or clamping a wafer (2);
- and
- a second coupling surface (42b) for coupling with a chuck (1) with the aid of negative pressure and/or vacuum and/or an applied magnetic field,
- wherein the first coupling surface (42a) of the sensor module (42) is configured to be arranged on a side of the sensor module (42) facing away from the chuck (1).
A method for arranging modules of a modular wafer-chuck system (40), comprising:
- providing a chuck (1) for temperature control of a wafer (2);
- coupling a sensor module (42) to a coupling surface (1a) of the chuck (1) with the aid of negative pressure and/or vacuum and/or an applied magnetic field;
- wherein the sensor module (42) comprises:
- a first coupling surface (42a) configured to mount or clamp a wafer (2);
- and
- at least one temperature-measuring means (6) for measuring a temperature of the sensor module (42) and/or of the chuck (1) and/or of a wafer (2) mounted or clamped by the wafer-chuck system
- wherein the first coupling surface (42a) of the sensor module (42) is configured to be arranged on a side of the sensor module (42) facing away from the chuck (1).
Dependencies are inferred from the claim text.