Metrology system for packaging applications

A method for packaging applications, comprising:

• supporting a substrate and another substrate disposed on the substrate on a substrate support, the substrate support operably coupled to an actuator configured to move the substrate and the another substrate back and forth in a scanning pattern;
• transmitting an illumination beam through the substrate and the another substrate;
• directing the illumination beam when transmitted through the substrate and the another substrate;
• moving the substrate and another substrate back and forth in a scanning pattern using the actuator;
• and
• receiving, at a sensor, the illumination beam to obtain subsurface images of the substrate and the another substrate, the sensor having a read-out rate, the sensor operably coupled to the actuator, the movement of the actuator synchronized with the read-out rate.

A non-transitory computer readable storage medium have instructions stored thereon that when executed by a processor perform a method for packaging applications, comprising:

• supporting a substrate and another substrate disposed on the substrate on a substrate support, the substrate support operably coupled to an actuator configured to move the substrate and the another substrate back and forth in a scanning pattern;
• transmitting an illumination beam through the substrate and the another substrate;
• directing the illumination beam when transmitted through the substrate and the another substrate;
• moving the substrate and another substrate back and forth in a scanning pattern using the actuator;
• and
• receiving, at a sensor, the illumination beam to obtain subsurface images of the substrate and the another substrate, the sensor having a read-out rate, the sensor operably coupled to the actuator, the movement of the actuator synchronized with the read-out rate.