Gas-permeable package lid of chip package structure and manufacturing method thereof
AssigneeIndustrial Technology Research Institute
InventorsLung-Tai Chen, Chin-Sheng Chang, Bor-Shiun Lee, Chih-Hsiang Ko
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Abstract
A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, a through hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed. The through hole penetrates the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and shields the through hole. A part of the hydrophobic gas-permeable membrane is embedded in the lid body.
Claims18
A gas-permeable package lid of a chip package structure, applied to a chip package structure, comprising:
- a lid body, integrally formed;
- a through hole, penetrating the lid body;
- and
- a hydrophobic gas-permeable membrane, bonded to the lid body and shielding the through hole, wherein a part of the hydrophobic gas-permeable membrane is embedded in the lid body,
- wherein the hydrophobic gas-permeable membrane comprises a membrane body and a plurality of positioning holes penetrating the membrane body, and the positioning holes are embedded in the lid body.
A manufacturing method of a gas-permeable package lid of a chip package structure, comprising:
- providing a hydrophobic gas-permeable membrane;
- and
- curing a packaging material in liquid state into a lid body, wherein a through hole is formed in the lid body and penetrates the lid body, the hydrophobic gas-permeable membrane shields the through hole, a plurality of positioning holes of the hydrophobic gas-permeable membrane are embedded in the lid body, and a plurality of hole anchoring portions of the lid body are respectively located in the positioning holes.
Dependencies are inferred from the claim text.