Manufacturing and measuring system for semiconductor structures

A system for manufacturing and measuring semiconductor structure, comprising:

• a process chamber;
• and
• a measuring device,
• wherein the process chamber is configured to perform operations including:
• forming a first fin array in a bank of a die of a wafer, wherein the first fin array has a plurality of fins including a first fin to a Nth fin spaced apart from each other, wherein N is a positive integer;
• and
• forming a second fin array on the first fin array, wherein the second fin array has a plurality of fins including a first fin to a Nth fin spaced apart from each other, wherein the fins of the first fin array are aligned with the fins of the second fin array respectively when the second fin array overlaps on the first fin array,
• wherein when top portions of the first fin and the Nth fin of the first fin array are tilted away therefrom, the measuring device is configured to perform a pattern wafer geometer (PWG) measuring on the wafer to obtain a displacement between the first fin of the first fin array and the first fin of the second fin array by the PWG in nanometer level, to obtain a displacement between the Nth fin of the first fin array and the Nth fin of the second fin array by the PWG in nanometer level, and further configured to determine a status of wafer according to the displacement.